Carigamers

Tech Talk => Hardware, Tweaking & Networking => Cooling Solutions => Topic started by: W1nTry on May 07, 2008, 11:12:00 PM

Title: A review in thermal compound application
Post by: W1nTry on May 07, 2008, 11:12:00 PM

I found some great articles on my daily peruse of the interweb and thought that many here could benefit from the tireless efforts of others. Without futher ado http://benchmarkreviews.com/index.php?option=com_content&task=view&id=170&Itemid=1 (http://benchmarkreviews.com/index.php?option=com_content&task=view&id=170&Itemid=1)

To take an excerpt:

Quote

There are two flaws in the HDT design currently used in CPU cooler products:

   1.
      The surface is rough and occasionally uneven.
   2.
      There are channels created between the mounting base and heat-pipe.

Fixing the first problem required some wet-sand paper and elbow grease (that's a metaphor for hard work, so don't go searching the web for another product).  By lapping down the surface to a flat even base, you can then polish it down to minimize the grain-like finish inherent of HDT products.